摘要
为提高半导体器件欧姆接触的可靠性，一般要在金属化系统中加扩散阻挡层。本文介绍了扩散阻挡层的种类及其特性，并进行了比较和讨论。最后给出了在实际成功应用的例子。
In order to improve ohmic contact reliability of semiconductor devices,the diffusion barrier layer is introduce into matallization system In this paper,the diffusion barrier layer types and properties are presented and discussed,and the comparison among them are made also The examples of the practically successful applications are given
出处
《微电子学与计算机》
CSCD
北大核心
1998年第5期53-56,共4页
Microelectronics & Computer
基金
北京市科技新星计划基金
