摘要
为使射频微波产品进一步实现小型化、通用化和系列化的设计、生产和应用,提出了一种基于多层有机复合基板的三维堆叠集成封装设计方法和工艺实现方法,并将其应用到了一款变频系统级封装(SiP)组件中。相较于二维高密度集成,基于多层有机复合基板的三维堆叠集成封装加强了垂直方向的空间利用率,能够进一步实现射频产品的小型化。多层有机复合基板三维堆叠模型的仿真和实测结果表明,此结构模型可以满足宽频带射频信号传输要求。采用多层有机复合基板三维堆叠方式设计的变频SiP组件的性能满足指标要求,设计方法和工艺实现方法具有可实现性。
In order to further realize the design,production and application of radio frequency microwave products in miniaturization,generalization and serialization,a three-dimensional stacking integrated package design method and a process realization method based on multilayer organic composite substrate are proposed and applied to a frequency-tunable system-in-package(SiP)component.Compared with two-dimensional high-density integration,the three-dimensional stacking integrated package based on multilayer organic composite substrate enhances the space utilization in the vertical direction and can further realize the miniaturization of radio frequency products.The simulation and test results of the three-dimensional stacking model of multilayer organic composite substrate show that the structural model can meet the requirements for wideband radio frequency signal transmission.The performance of the frequency-tunable SiP component designed by three-dimensional stacking of multilayer organic composite substrates meets the requirements of the index,and the design method and the process realization method are feasible.
作者
姚剑平
李庆东
管慧娟
杨先国
苟明艺
YAO Jianping;LI Qingdong;GUAN Huijuan;YANG Xianguo;GOU Mingyi(Chengdu Seekon Microwave Communications Co.,Ltd.,Chengdu 610091,China)
出处
《电子与封装》
2025年第4期48-51,共4页
Electronics & Packaging
关键词
三维堆叠
系统级封装
球栅阵列
小型化
three-dimensional stacking
system-in-package
ball grid array
miniaturization
