摘要
为解决微波多芯片组件(Microwave Multi-Chip Module,MMCM)中键合互连线的设计问题,采用三维电磁场软件HFSS和电路设计软件Ansoft Designer对键合线的模型进行了仿真分析。根据仿真结果,提取了键合线的等效电路参数。最后建议采用增加线宽的微带线结构结合两到三根键合线,以达到优化设计的目的。
In order to design a bondwire interconnect in Microwave Multi-Chip Module（MMCM）, the 3D electromagnetic analysis software HFSS and circuit design software Ansoft Designer are introduced into the simulation analysis of bondwire models. Based on the simulation results, the equivalent circuit parameters of bondwire are extracted. Finally, an optimized method of bondwire design using microstrip whose width has been increased combining with two or three bondwires has been proposed.
出处
《信息与电子工程》
2007年第1期40-43,共4页
information and electronic engineering
