摘要
航天技术的快速发展,推动了电子器件在深空低温下的可靠性研究。由于大多数电子器件失效是由焊点失效引起的,故在-125~25℃范围内对微尺度球栅阵列(BGA)结构Cu/Sn-3.0Ag-0.5Cu (SAC305)/Cu进行了剪切试验。研究表明,焊点的剪切性能呈现出显著的温度相关性。随着测试温度的降低,Cu/SAC305/Cu焊点的剪切强度呈现出持续增强的趋势。焊点的断裂路径会随温度的变化发生显著的迁移,从钎料基体逐步向钎料/IMC层界面过渡。焊点的失效模式也随之从韧性主导型逐渐转变为脆性失效模式,其韧-脆性转变温度接近于-75℃。
With the rapid advancement of the aerospace technology,the reliability research of electronic devices at low temperatures in deep space has been accelerated.Since most electronic device failures are caused by solder joint failures,the shear tests on micro-scale ball grid array(BGA)structure Cu/Sn-3.0Ag-0.5Cu(SAC305)/Cu were carried out in the temperature range of-125℃to 25℃.Research indicated that the shear performance of solder joints exhibited significant temperature dependency.As the test temperature decreased,the shear strength of Cu/SAC305/Cu were carried out solder joints showed a continuously upward trend.The fracture path of solder joint underwent significant migration with temperature changed,gradually transitioning from the solder matrix to the solder/IMC layer interface.Consequently,the failure mode of solder joint gradually shifted from ductile-dominated mode to brittle failure mode,the ductile-brittle transition temperature was close to-75℃.
作者
桂俊
GUI Jun(School of Mechanical and Electrical Engineering,Guilin University of Information Technology,Guilin 541004,Guangxi,China)
出处
《热处理技术与装备》
2025年第2期36-39,51,共5页
Heat Treatment Technology and Equipment
基金
2024年桂林信息科技学院人才引进科研项目“BGA结构Sn基无铅微焊点在低温下的剪切行为研究”(026105)
2024年度桂林信息科技学院科学研究项目“极端环境下Sn基无铅微互连结构的剪切行为研究”(ZX02561503)。
关键词
电子器件
剪切性能
断裂机理
航天产品
electronic devices
shear performance
fracture mechanism
aerospace product
