摘要
为满足下一代卫星通信机载有源相控阵天线系统小型化要求,采用三维堆叠系统级封装(SiP)中的硅通孔(TSV)技术,设计并实现一种高集成度的4通道S波段射频SiP模块。该SiP模块采用0.2 mm厚度的声表滤波器芯片,尺寸仅为15.8 mm×16.8 mm×1.95 mm,相较于传统高温共烧陶瓷封装模块,体积缩小85%以上。使用辅助设计软件对SiP模块进行设计与仿真,实测结果显示,该SiP模块在1980~2300 MHz频率范围内,增益为1~5 dB,幅度一致性优于±1 dB,相位一致性优于±5°,带外抑制优于30 dB(1980~2010 MHz频段优于50 dB)。
To meet the miniaturization requirements of the next generation satellite communication airborne active phased array antenna system,a highly integrated 4-channel S-band RF system-in-package(SiP)module is designed and implemented using through-silicon via(TSV)technology in the three-dimensional stacked SiP.The SiP module adopts 0.2-mm-thick acoustic filter chip,and the size of the module is only 15.8 mm×16.8 mm×1.95 mm,which is more than 85%smaller than the traditional high temperature co-fired ceramic packaged modules.The SiP module is designed and simulated using the auxiliary design software.The measured results show that in the frequency range of 1980-2300 MHz,the gain of the SiP module is 1-5 dB,the amplitude consistency is better than±1 dB,the phase consistency is better than±5°,and the out-of-band rejection is better than 30 dB(better than 50 dB in the frequency rang of 1980-2010 MHz).
作者
傅祥雨
FU Xiangyu(Chengdu Spaceon Electronics Co.,Ltd.,Chengdu 610037,China)
出处
《电子与封装》
2025年第4期57-62,共6页
Electronics & Packaging
关键词
小型化
系统级封装
硅通孔
幅相一致性
miniaturization
system in package
through silicon via
amplitude and phase consistency
