摘要
微波多层板加工一般通过垂直金属化孔实现不同层之间的连接。当印制线层数增多时,不同层之间的互连关系复杂,需要采用任意层互连加工技术,该技术工艺复杂,成本高。提出了一种实现微波信号任意层互连的新方法:通过BGA工艺实现两块多层板间的准同轴垂直过渡的互连,从而简化任意层微波信号互连关系。给出了BGA垂直互连理论分析、仿真及优化模型。子阵级微波多层板BGA互连试验证明该形式任意层微波信号垂直互连满足工程需求,简化制作工艺,降低制造成本。
The connection between different layers is usually realized through vertical metallization holes. When the number of PCB layers increases, the interconnection between different layers are complex. Any layer interconnection processing technology is required. The processing technology is complex and has high cost.This paper presents a new method to achieve arbitrary layer interconnection. The transition of quasi-coaxial between two multilaminates is realized by BGA. This method simplifies the interconnection between microwave boards of any layer. This paper offers theoretical analysis simulation and optimization model of BGA vertical interconnection. The test of subarray microwave multilayer BGA interconnection proves that the interconnection meets the engineering requirements, simplifies the manufacturing process and reduces the manufacturing cost.
作者
郑钰
姜文
凌天庆
卢威
Zheng Yu;Jiang Wen;Ling Tianqing;Lu Wei(Nanjing Research Institute of Electronic Technology,Nanjing 210039,China)
出处
《电子测量技术》
2020年第7期137-141,共5页
Electronic Measurement Technology
关键词
BGA
多层板
垂直互连
BGA
multilayer board
vertical interconnection
