摘要
PCB行业高密度互连技术发展促使芯板激光通孔在HDI板设计中广泛应用。相较于业界常用的水平电镀填孔工艺,本研究聚焦垂直连续电镀线。以实验手段深入探究脉冲电镀参数、无机药水成分及电镀添加剂比例等对激光通孔填孔的影响机制。经系统验证与分析,确立最优电镀条件并应用于实际生产,成功赋予生产线激光通孔搭桥能力,实现高质量激光通孔填孔工艺,为PCB行业电镀填孔工艺优化提供关键参考与实践指引。
The development of high-density interconnect technology in the PCB industry has promoted the wide application of core with laser via design in the HDI boards.Compared with the horizontal electroplating via-filling process commonly used in the PCB industry,this study focuses on the Vertical Continuous Plating line.This article introduces some influence factors,for example pulse plating parameters,inorganic chemistry,additive,etc.After systematic verification and analysis,the optimal plating parameter that makes bridging and filling laser via in the process are established and applied to actual production.
作者
张剑如
郭东旭
郭景锐
Zhang Jianru;Guo Dongxu;Guo jingrui
出处
《印制电路信息》
2025年第S1期142-147,共6页
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