摘要
近年来,随着电子产业的快速发展,对印制电路板的要求越来越高,超高板厚孔径比PCB已经成为亟待挑战的重点课题。本研究针对高AR比50:1通孔电镀铜的可行性进行了深入探讨。通过设备改造和药水搭配的优化成功提升通孔电镀能力,使得50:1(7.5 mm板厚/0.15 mm孔径)的TP能力>80%,有效解决了制程瓶颈问题。研究结果表明,在“八字型”左右+前后复合摇摆加之>4.0 L/Min的单喷嘴喷淋流量的设备加持下可有效提供高厚径比通孔的灌孔效率,再通过精确控制电镀参数和选择合适的电镀溶液,可以显著提高高厚径比通孔电镀的质量和效率,对于提升PCB电镀制程的技术水平具有重要意义。
In recent years,with the rapid development of the electronics industry,the requirements for electronic printed boards have become increasingly high,and ultra-high board thickness to aperture ratio PCB boards have become a key challenge that urgently needs to be addressed.This study conducted an in-depth exploration of the feasibility of high AR ratio 50:1 through-hole copper electroplating.Through equipment modification and optimization of solution combination,the through-hole electroplating capability has been successfully improved,resulting in a TP capacity of 50:1(7.5 mm plate thickness/0.15 mm aperture)80%,effectively solving the bottleneck problem in the process.The research results indicate that with the support of a single nozzle spray flow rate of 4.0L/min and a combination of left and right"eight shaped"and front and rear composite swinging,the filling efficiency of high thickness to diameter ratio through holes can be effectively provided.By precisely controlling the plating parameters and selecting the appropriate plating solution,the quality and efficiency of high thickness to diameter ratio through hole plating can be significantly improved,which is of great significance for improving the technical level of PCB plating process.
作者
谭荣
蔡耀德
蔡昆庭
Tan Rong;Cai Yaode;Cai Kunting
出处
《印制电路信息》
2025年第S1期165-171,共7页
Printed Circuit Information
关键词
超高厚径比
通孔电镀
脉冲电镀
深镀能力
Ultra-High Aspect Ratio
Through-hole electroplating
Pulse electroplating
Throwing Power
