摘要
多层高密度互连印制电路板(HDI PCB)高可靠性的一个关键因素是堆叠盲孔互连的热稳定性。随着HDI产品盲孔孔径的减小和互连层数的增加,这些互连的结构完整性成为一个关键因素,也是当前研究中备受关注的话题。化学铜层与电镀铜层之间存在纳米孔洞产生的原理相对比较复杂,无法通过热电流测试(HCT)或者常规测试手段进行识别。本文分享了纳米孔洞产生的可能因素,并通过CP+SEM检测方法进行识别,对未来更高端HDI产品的品质提升提出一些观点。
This article mainly introduces the technology and application of LCD photoelectric products,as well as the characteristics of LCD photoelectric product circuit boards.Through analyzing the difficulties in the production of LCD photo electric product circuit boards,and exploring the issues in the actual production process and customer concerns,it summarizes the design guidelines and control methods for LCD photoelectric product circuit boards,and ultimately achieves batch product ion of LCD photoelectric product circuit boards.
作者
毛永胜
孙炳合
王楠
覃新
孙守军
Mao Yongsheng;Sun Binghe;Wang nan;Qin Xin;Sun Shoujun
出处
《印制电路信息》
2025年第S1期300-309,共10页
Printed Circuit Information
关键词
纳米孔洞
HDI
回流模拟
化学铜
电镀铜
Nanovoid
HDI
Reflow Simulation
Chemical Copper
Electroplated Copper
