摘要
某型设备在长期使用过程中出现了LCCC封装器件焊点重复性失效的故障,对产品的功能、性能造成了一定的影响。对故障原因进行了分析,开展了复现试验,提出了相应的改进措施并对改进措施的有效性进行了试验验证。结果显示,改进措施落实后,降低了产品的故障率,得到了顾客的认可。
The repeated failure of solder joint of LCCC packaging device occurs in a equipment in the process of long term use,which has certain effect on the function and performance of the product.The causes of the failure are analyzed,and the reappearance test is carried out.Besides,the corresponding improvement measures are put forward and the effectiveness of the measures is tested and verified.The results show that the failure rate is reduced and the customers approval is obtained after the measures are implemented.
作者
吕正
宋阳
LV Zheng;SONG Yang(The 20th Research Institute of CETC,Xi'an 710068,China;Xi'an Polytechnic University,Xi'an 710048,China)
出处
《电子产品可靠性与环境试验》
2018年第6期9-14,共6页
Electronic Product Reliability and Environmental Testing
