摘要
基于ABAQUS有限元分析软件,利用子模型法对PBGA封装结构的焊点在温度循环载荷下的应力场进行了研究,并比较了不同焊点直径、焊点高度、焊点间距对其应力场的影响规律。结果表明,焊点的最大应力值与焊点直径和焊点间距成正比,与焊点高度成反比。研究结果对焊点的可靠性评估和优化设计有一定的指导意义。
The stress field of solder joint for PBGA package was analyzed under the thermal cyclic loading by submodel method based on the ABAQUS software. The influence regularities of different diameters, heights and distances of solder joint on the stress field were studied. The results indicate that the maximum stress of solder joint is in direct proportion to the height and distance and in inverse proportion to the diameter of solder joint, which are expected to act as database for improving reliability evaluation and optimized design of solder joint.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2011年第24期141-143,共3页
Materials Reports
基金
航空科学基金(20090247001)
关键词
子模型
焊点
热应力
影响规律
submodel, solder joint, thermal stress, influence regularities
