摘要
LCCC封装器件具有体积小和电性能好的特点,因此应用越来越广泛。但是,由于其无引线特点,以及本体材料与基板FR-4材料的热膨胀系数不匹配,在温度变化过程中焊点应力集中,容易导致疲劳失效。在分析LCCC封装器件高可靠焊接要求和影响焊点可靠性寿命因素的基础上,分别选择28引脚、44引脚和64引脚三种LCCC封装器件进行焊接试验,并通过温度循环试验验证焊点的可靠性,最终得出验证结果。
The LCCC package has the advantages of small volume and good electric properties,so it is widely used.However,the stress concentration of solder joint of LCCC package easily causes the creep-fatigue damage as the temperature change,because of LCCC package characteristics of no leads,the coefficient of thermal expansion doesn’t match with FR4.Select 28 pin,44 pin and 64 pin package for soldering experiments,and verify the reliability of solder joints through the temperature cycling test,according to the requirements of high-reliablility soldering and the factors which affect relialility of solder joint.And get the guidance to improve soldering quality of LCCC packag.
出处
《电子工艺技术》
2013年第4期200-203,共4页
Electronics Process Technology
关键词
LCCC
焊点
可靠性
LCCC
Solder joint
Reliability
