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Sn-Ag-Cu焊点IMC生长规律及可靠性研究 被引量：3

The Study of IMCs Growth and Reliability of Sn-Ag-Cu Solder Joint
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摘要 Sn-Ag-Cu焊料目前是最有希望替代Pb-Sn合金的焊料。在回流焊过程和电子产品服役过程中,Sn-Ag-Cu焊料与基体金属间形成的金属间化合物(IMC)及其演变是影响焊点可靠性的主要因素之一。本文针对Sn-Ag-Cu焊料与Cu和Au/Ni/Cu界面形成的IMC,分析其回流和时效过程中IMC的变化规律。 Sn-Ag-Cu alloy is one of the promising lead-free alloys currently being evaluated by industry while entering the lead-free era. Intermetallic compound（IMC） is one of the main factors of reliability in the process of reflow and service of electronic products.This paper summarizes the change of IMCs in solder joints based on Sn-Ag-Cu alloy with Cu or Au/Ni/Cu while reflowing and aging.
作者 何明敏 吴丰顺 张伟刚 吴懿平 安兵
机构地区 华中科技大学材料学院
出处 《电子质量》 2006年第8期25-29,共5页 Electronics Quality
关键词 无铅 金属间化合物 可靠性 回流焊 时效 Lead-free Intermetallic compound rellability Reflow Aging
分类号 TN306 [电子电信—物理电子学] O614 [理学—无机化学]
  • 相关文献

参考文献4

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二级参考文献30

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共引文献26

同被引文献17

  • 1顾永莲,杨邦朝.无铅焊点的可靠性问题[J].电子与封装,2005,5(5):12-16. 被引量：23
  • 2李晓延,严永长,史耀武.金属间化合物对SnAgCu/Cu界面破坏行为的影响[J].机械强度,2005,27(5):666-671. 被引量：27
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  • 10鞠国魁,韦习成,孙鹏,刘建影.界面金属间化合物对铜基Sn-3.0Ag-0.5Cu焊点拉伸断裂性能的影响[J].中国有色金属学报,2007,17(12):1936-1942. 被引量：12

引证文献3

二级引证文献2

电子质量
2006年 第8期

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