摘要
对通讯电子产品中常用到的Sn3.0Ag0.5Cu无铅BGA焊点进行了温度循环及四点弯曲可靠性能实验研究。对比了两种可靠性能实验研究中无铅焊点裂纹扩展特征,发现四点弯曲试验中裂纹为沿晶和穿晶混合模式,温度循环裂纹扩展一般沿晶进行,并且温度循环实验后断面处存在明显的再结晶现象。
The thermal cycling and Four-points bending reliable properties of the lead free Sn3.0Ag0.5Cu BGA joint were investigated and their characterizations of the crack propagation were compared.It was found that the crack could propagate along the grains boundary or across the grain in the bending test,while in the thermal cycling test the crack propagated along the grain boundary.And the recrystallization was observed at the fracture surface after the thermal cycles.
出处
《电子工艺技术》
2010年第6期332-333,353,共3页
Electronics Process Technology
基金
广东省科技计划项目(项目编号:2008A080403008)
广东省重大专项项目(项目编号:2009A080204009)
广东省粤港关键领域招标项目(项目编号:2008A092000007)
关键词
裂纹
金属间化合物
再结晶
crack
intermetallic compound
recrystallization
