摘要
塑封电子元器件在如今的封装产业中有着其他器件不可替代的优势,对其性能与功能的研究引起了社会的高度关注。文章首先从三个方面对塑封电子元器件的温度失效问题进行了详细地概述,然后从冲温与低温失效、潮气入侵、以及塑封工艺缺陷3个方面对塑封电子元器件的失效机理一一阐述清楚,希望对同行业朋友有所参考价值。
Plastic electronic components in today＇s packaging industry have other irreplaceable advantages. The study on the performance and function attracts high attention of the society. This article first gives a detailed overview of temperature failure of encapsulated electronic components from three aspects, and clearly elaborates from red and low temperature failure and moisture intrusion, encapsulation process defects, which have reference value for friends in the same industry
出处
《现代工业经济和信息化》
2015年第10期26-27,共2页
Modern Industrial Economy and Informationization
关键词
塑料封装
电子元器件
温度
失效机理
plastic packaging
electronic components
temperature
failure mechanism
