摘要
论文综述了自1990年代以来迅速发展的先进封装技术,包括球栅阵列封装(BGA)、芯片尺寸封装(CSP)、圆片级封装(WLP)、三维封装(3D)和系统封装(SiP)等项新技术;同时,叙述了我国封装产业的状况和发展趋势;并对我国快速发展先进封装技术提出了一些思索和建议。
This paper describes the advanced packaging technology which has developed rapidly during the 1990s. The technology includes BGA、CSP、WLP、3D packaging and SiP etc. And it introduces the status and trend of packaging industry in China. In addition it gives some considerations and suggestions for promoting the advanced packaging technology in china.
出处
《中国集成电路》
2006年第10期47-53,共7页
China lntegrated Circuit
