摘要
化学镍金工艺会产生基材渗镀的问题。讨论了FPC基材渗镀化学镍金的形成机理,采用硝酸法研究了基材渗镀化学镍金的控制要点,应用正交实验优化了硝酸处理FPC基材渗镀化学镍金的工艺参数。结果表明硝酸法可有效控制基材吸附镍金层,获得了最佳硝酸处理的工艺参数:活化时间90 s,温度30℃,硝酸浓度3 mol/L,反应时间30 s。
ENIG （Electroless Nickel/Immersion Gold） layer can be deposited in base materials during manufacturing processes. The mechanism was discussed on depositing ENIG in FPC base materials. Nitric acid was applied for preventing base materials adsorbing with ENIG layer. Parameters of nitric acid process were optimized with orthogonal experiments. The results shown base materials adsorbing with ENIG layer could be effectively prevented via nitric acid method and best parameters of nitric acid process were obtained as activation time of 90 seconds, temperature of 30℃, nitric acid concentration of 3 mol/L, reaction time of 30 seconds.
出处
《印制电路信息》
2013年第5期42-45,共4页
Printed Circuit Information
关键词
化学镍金
渗镀
硝酸法
优化实验
ENIG
Deposit
Nitric Acid Process
Orthogonal Experiments
