摘要
为了提高刚挠结合板的挠曲次数,往往把挠性区做成两层或两层以上的分层结构。这种结构就要使用到单面软板。两个单面挠板的粘合一般都使用丙烯酸胶膜。和刚板不同的是,挠板中的PI(聚酰亚胺)和丙烯酸都有很大的塑性。钻完刚性区通孔后,孔内的挠板区由于材料还有一定的弹性恢复就会有几微米到几十微米的尺寸突出。在该区域,它与孔金属化铜层之间结合力会非常低。为此,本文将通过优化试验参数,获得最佳的试验参数,并通过机理的研究,指导制作出平整,优良的孔壁,获得优良的金属化孔。
To enhance flexibility of rigid-flex PCB （Printed Circuit Board）, the flex area is usually delaminated to two or more single layers. Thus, the flex copper-clad laminates in rigid-flex board must be single side. And the substance which bond them together in rigid area is cyclic acid film. Unlike rigid materials, the flex materials have large plasticity. For this reason, the flex part in side-wall of via hole will extend out beyond other part in the drilling process. Consequently, the bond strength between plated copper and the flex part is greatly lower than other parts in plating process. In this paper, the optimized parameters in drilling process were obtain by orthogonal trail to reduce the extended part. And the drilling mechanism was also studied.
出处
《印制电路信息》
2009年第6期38-41,共4页
Printed Circuit Information
关键词
丙烯酸
刚挠结合板
钻孔
切削机理
cyclic acid film
rigid-flex PCB
drilling
cutting mechanism
