摘要
随着电子产品向着高密度方向的发展,印制电路板和封装基板的盲孔孔径和线路的线宽/线间距越来越小,半加成工艺在印制电路板及封装载板的制作过程中得到越来越广泛的应用。采用半加成工艺,以ABF材料作为介质层,制作线宽/间距为14μm/14μm线路和65μm盲孔。介绍半加成工艺制作的主要流程、使用材料、工艺难点及解决方法。
Latest build-up boards are requested to achieve high-density wiring,and reduction of blind via hole diameter and reduction of line width and space of patterns are rapidly progressing.For that reason,PCB and IC substrate are coming to be manufactured by semi-additive process.We fabricated fine line 14 μm/14 μm and blind via hole（65 μm） using ABF material by semi-additive process.Processes,materials,difficulties and solutions would be addressed.
出处
《电子工艺技术》
2013年第3期151-154,共4页
Electronics Process Technology
关键词
精细线路
半加成工艺
盲孔
ABF
Fine line
Semi-additive process
Blind via hole
ABF
