摘要
塑料基体直接电镀的工艺为:用含Pd2+离子的CrO3和H2SO4混合液进行粗化,使其表面获得均匀的粗糙度和改善后续活化工艺中钯的吸附效果。在还原工序中添加了一种特殊的表面活性剂,来增加钯的吸附。经过铜置换工序,Cu2+及其络合物在塑料表面移除了Sn2+,使得表面形成钯铜的导电膜,可以直接镀酸性铜。新型塑料电镀工艺不仅无需使用化学镀,而且操作更加容易,稳定性提高,废水处理简单,大大缩短了生产时间,生产中途无需更换挂具,生产率大大提高。
The mixture of CrO3 and H2SO4 solutions with addition of Pd^2＋ was applied for etching process,and then the plastics have a uniform surface and an enhanced Pd^2 ＋ /Sn^2 ＋ colloids absorption properties.In the reduction process,a special surfactant was used to improve the colloids absorption.During the CuLink process,Sn^2 ＋ ions around Pd0 in the colloids solution was removed by Cu^2 ＋ and copper complex,and then a Pd-Cu conductive layer was formed and easily to be plated by acid copper on plastics.This new plastics direct plating process has the advantage of exclusion of electroless plating process,easier operation,higher solution stability,convenient wastewater treatment and without replacement of the rack.So the production time is decreased obviously and the productivity is greatly increased.
出处
《电镀与精饰》
CAS
北大核心
2010年第8期9-12,44,共5页
Plating & Finishing
关键词
塑料电镀
粗化
活化
直接金属化
plastics plating
etching
activation
direct metallization
