摘要
主要从基材及钻孔,电镀,干膜,表面处理(沉镍金,沉银,OSP,热风整平)等工序分析孔破产生的原因及型态并给出对应的解决方法。
This article mainly analyzes the causes and forms of hole broken from laminate and the processes of drilling, plating, dry film, surface treatment （immersion Ni/Au, immersion Ag, OSP, H.A.L）.at the same time, provide the method of solution.
出处
《印制电路信息》
2012年第12期33-40,56,共9页
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