锡涂覆层将起支柱作用

Tin Finishes Drum up Support

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摘要在多重再流焊循环中,一种新奇的浸渍锡将掘起. 1引言由于热风焊料整平(HASL)表面涂覆具有好的可焊性和连接点的可靠性而得到了广泛的应用.但是由于元件的进步要求有更高的共面性,因而造成HASL潜在的缺点,加上含铅已面临着广泛的禁用,使HASL应用率下降了.

作者 Kuldip Johal Hans-juergen Schreier 丁志廉

出处《印制电路信息》 2001年第5期27-30,共4页 Printed Circuit Information

关键词锡涂覆层多重再流焊印刷电路板

参考文献5

1[1]Andrascek, at el;"Bath for Electroless Deposition of Tin on Copper",Ger offen. DE. 3. 800,918.
2[2]Atotech Berlin," Technical Information Stannatech, The Unique Immersion Tin Process",Aug, 1999
3[3]Cunningham , K.M., et al;" Tin Whiskers:Mechanism of Growth and Prevention," 4th International SAMPLE Electronics Conference,Pg. 569June 1990
4[4]Fisher, Jack," Roadmapping the final Finishes" ,IPC National conference on surface finishes,Sept. 1998
5[5]Nimmo, Kay. "Worldwide Environmental Issues in Electronics and the Transition to leadfree, "IPG works proceedings, Oct. 1999

印制电路信息

2001年第5期

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