摘要
介绍了以石墨作为导电基质,进行印刷电路板孔金属化直接电镀的黑孔新技术,探讨了以石墨分散液在孔壁成膜的过程与导电原理。介绍了黑孔处理的工艺流程,以及黑孔质量与黑孔液稳定性的检测方法。通过孔横截面的金相显微照片确认了通孔与盲孔经过以石墨为导电基质的黑孔液处理后,均能获得完整的电镀铜层。
This article describes a new technology of graphite as a conductive matrix used in plated throughhole by direct plating. Surface film formation process and the conductivity principle of the graphite dispersion are investigated in porous. The black hole process and relative test are summarized. It is found that the hole crosssection of both blind holes and through holes after the black hole processes by means of direct plating copper can form a complete copper layer through metallographic photos.
出处
《印制电路信息》
2012年第7期40-43,共4页
Printed Circuit Information
关键词
石墨
孔金属化
黑孔化
直接电镀
graphite
plated through hole
black hole process
direct plating
