摘要
借助ANSYS有限元分析软件,使用子模型分析技术对单晶结构和多晶结构两种不同晶体类型的无铅BGA焊点做了应力应变计算,并结合通过扫描电镜(SEM)获取的断裂焊点截面照片,对比分析了不同晶体类型对BGA焊点疲劳断裂失效的影响。得出结论:焊点晶体类型也是影响无铅BGA焊点疲劳断裂失效的重要因素。
Submodeling is applied to calculate the stress and strain of both monocrystalline and polycrystallime of Pb-free BGA solder joint by ANSYS, which is a finite element analysis software, combined with pictures of the cross-section of solder joints obtained by scanning electronic microscope （SEM）. The effect of different types of crystal on the fatigue fracture of BGA solder joint is investigated. And the type of crystal is one of key factors which make an effect on the fatigue fracture of Lead-free BGA solder joint.
出处
《电子工艺技术》
2014年第4期210-213,共4页
Electronics Process Technology
基金
国防基础科研(项目编号:A1120132016)
