摘要
高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现,X-射线(X-ray)检测技术就是其中之一,它能有效控制BGA的焊接和组装质量。现在X-ray检测系统不仅仅只是用在实验室失效分析,已经被专门设计用于生产环境中的PCB组装和半导体行业,提供高分辨率的X-ray系统。本文扼要地介绍X-ray检测技术的原理及应用,指出了X-ray检测技术是保证电子组装质量的必要手段。
The rapid development of high density packaging technology has already brought up the new challenge to testing technology.For replying challenge,the new testing technology continuously appears,X-ray inspection is one of them,it can be used to control quality of BGA soldering and assembly.Now X-ray inspection systems have been specifically designed for PCB Assembly and semiconductor industries offering high resolution X-ray systems not only within failure analysis laboratories but also within the production environment.This paper simply introduces the theory and the application of X-ray inspection,indicates that X-ray inspection is necessary method to guarantee the quality of electronics assembly.
出处
《印制电路信息》
2010年第11期66-70,共5页
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