摘要
高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现,X-ray检测技术就是其中之一,它能有效控制BGA的焊接和组装质量。介绍X-ray检测技术的原理及未来发展趋势。
The rapid development of high density packaging technology has already bring up the new challenge to testing technology. For replying challenge, the new testing technology continuously appears, X-ray inspection is one of them, it can be used to control quality of BGA soldering and assembly. This paper simply introduces the theory of automatic X-ray inspection, the development of it is also mentioned.
出处
《电子工业专用设备》
2005年第9期34-36,45,共4页
Equipment for Electronic Products Manufacturing
