摘要
Distribution forms of abrasives in the chemical mechanical polishing（CMP） process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics.According to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are obtained.The analysis results are in accord with the experimental results.The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP.
Distribution forms of abrasives in the chemical mechanical polishing（CMP） process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics.According to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are obtained.The analysis results are in accord with the experimental results.The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP.
基金
supported by the Major Project of National Natural Science Foundation of China(No.50390061)
the Key Project of Science and Technology R & D Program of Henan Province,China(No.102102210405)
the Research Project Program of Natural Science of the Education Department of Henan Province,China(No.2009A460004)
the Scientific Research Foundation of Henan Institute of Science and Technology for High Level Scholar
the Science and Technology Innovation Program of Henan Institute of Science and Technology.
