期刊文献+

基于照片影像的反求设计及三维仿真平台开发

Development of platform of reverse engineering and 3D simulation on photograph image
在线阅读 下载PDF
导出
摘要 基于照片影像的反求工程和三维立体重建是企业新产品开发的重要途径之一。这里对照片影像反求设计方法作了较深入的探讨。在此基础上,研制开发了基于照片影像的反求设计及三维仿真的CAD平台。该平台的设计是在AutoCAD平台上,应用VisualLisp程序设计语言开发出“透视图布局”、“点反求”和“立体三维重建”等程序,并用AutoCAD的菜单定制技术为平台定制新增命令和帮助文件。应用实例证明该平台系统能够快速准确、半自动化地完成以平面体为主而组合的产品照片的反求设计与三维仿真。 Reverse engineering and 3D surface reconstruction based on the photo image are one of important approach that the business enterprises develop new products. This paper propose a method of reverse design for photograph image , and develop a CAD platform with reverse design and 3D surface reconstruction. Development of the platform is applied Visual Lisp program design language to program such us "perspective layout", "point reverse ", "3D surface reconstruction" and so on, and the help files and the menu is custom- made for the CAD system . The experiments proof that Reverse engineering and 3D surface reconstruction for the products photograph which are made up mostly fiat solids can be completed quickly, accurately and semi - automatically by means of the platform.
机构地区 衢州学院机电系
出处 《机械设计与制造》 北大核心 2006年第5期76-78,共3页 Machinery Design & Manufacture
基金 衢州市科技计划项目(项目编号:20041018)
关键词 照片影像 反求工程 三维仿真 平台 程序设计 Photograph image Reverse engineering 3D simulation Platform Program design
  • 相关文献

参考文献6

二级参考文献21

  • 1..http://www.brewerscience.com.,.
  • 2[1]Zhang Ruo, Tsai Pingsing, James Cryer. Shape from Shading: A Survey[J]. IEEE Transactions on Pattern Analysis and Machine Intelligence, 1999, 21(8): 690~706.
  • 3[2]Mcmillan L, Gortler S.Image-based Rendering:A New Interface Between Computer Vision and Computer Graphics[J].Computer Graphics,1999,33(4):61~64.
  • 4[3]Kwon Y H, Da Vitoria. Age Classification from Facial Images[J]. Computer Vision and Image Understanding Journal, 1999,74(1): 1~21.
  • 5Laertis Economikos. STI planarization using fixed abrasive technology, http://www.future- fab.com/.
  • 6Vo T, Buley, T Gagliardi J. Improved planarization for STI with fixed abrasive technology. Solid State Tech.,2000(6): 23-28.
  • 7Van der Velden. P Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity. Microelectronic Engineering, 2000, 50:41--46.
  • 8Nguyen V H, Hof A J, Kranenburg H Van, et al, Copper chemical mechanical polishing using a slurry-free technique. Microelectronic Engineering, 2001, 55: 305~312.
  • 9Li S J, Sun L Z, Stan Tsai, et al, A low cost and residuefree abrasive-free copper CMP process with low dishing.Erosion And Oxide Loss, IITC 2001 / IEEE.
  • 10Annabel Nickles, Dan Marohl, Gopal Prabhu, et al. Slurryless CMP enables next-generation direct polish STI.http://sst.pennnet, com/Articles.

共引文献98

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部