摘要
介绍用于０．８～１μｍ分步重复投影光刻机的六自由度硅片定位系统。讨论了气足、承片台系统及ＳＴＡＭＰ的设计和计算方法，并给出了设计数据与计算结果。本系统在Ｘ、Ｙ１、Ｙ２三个方向达到了±０．１μｍ（３σ）的重复定位精度、±５０ｎｍ的调焦分辨力和５μｍ／全片的调平精度。
A 6 D wafer positioning system used in 0.8~1μm wafer stepper is introduced in the paper.The air foot,wafer supporting stage system,the design and calculating methods of STAMP are discussed,the design data and calculating results are given.The system has realized ±0.1μm(3σ) repeat positioning accuracy in three directions of X,Y 1 and Y 2 ,±50nm focusing resolution and 5μm leveling accuracy for the whole wafer.
出处
《光电工程》
EI
CAS
CSCD
1998年第3期7-11,共5页
Opto-Electronic Engineering
基金
国家"八五"科技攻关项目
关键词
分步重复光刻机
定位系统
调焦
机构
调平
光刻
Step and repeat photoetching machines,Position systems,Focusing mechanisms,Levelling mechanisms.
