摘要
文章运用正交实验法对沉铜前处理中的微蚀工艺参数进行了分析,确定了得出了影响微蚀速率的主要因素,得出了最佳生产条件。最后做出直观图验证了实验结果。
Technological parameters of the micro etching process before electro less copper plating for PCB are analyzed by orthogonal trial method in this paper. Then both the main factors which influence the rate of micro etching and the optimal condition for production are found. Finally, the conclusion is demonstrated by drafting a visual graph.
出处
《印制电路信息》
2010年第3期19-21,共3页
Printed Circuit Information
关键词
正交实验法
微蚀
微蚀速率
工艺参数
orthogonal trial method
micro etching
the rate of micro etching
technological parameters
