摘要
通过试验分析,得出了温度、pH、浓度与化学镍、化学金析出速率的关系,为精确控制化学镍、化学金的镀层厚度、降低化金成本提供了依据。
In this paper, experimental analysis shows the relationship between variables （temperature, concentration, pH etc.） and rate of ENIG. Also, this article established a regression model, which could be used to predict the thickness of ENIG and to reduce the cost in practical production.
出处
《印制电路信息》
2011年第12期52-54,72,共4页
Printed Circuit Information
关键词
化学镍金
沉积速率
分析与应用
ENIG（electroless nickel and immersion gold）
reaction rate
analysis and application
