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刚挠板等离子清洗去钻污工艺参数的非线性回归分析 被引量：3

Non Linear Regression Analysis of Technological Parameter of the Plasma Desmear Process for Rigid-Flex PCB
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摘要 详细的介绍了用正交试验优化刚挠板等离子清洗去钻污的工艺参数,并采用Minitab统计分析应用软件对正交试验的结果进行非线性回归分析,通过回归方程实现了对生产的预报和控制。 Technological parameter of the plasma desmear process for rigid-flex PCB is optimized by orthogonal test. Non linear regression analysis is earred out for the results of orthogonal test by minitab statistical analysis soft ware.Prediction and control for production, are realized by regression equation.
作者 何为 汪洋 何波 刘美才 王慧秀
机构地区 电子科技大学应用化学系 珠海元盛电子科技有限公司
出处 《印制电路信息》 2006年第6期44-47,共4页 Printed Circuit Information
关键词 刚挠板 等离子清洗 去钻污 非线性回归分析 rigid-flex PCB plasma desmear desmear non linear regression analysis
分类号 TN45 [电子电信—微电子学与固体电子学] TN41 [电子电信—微电子学与固体电子学]
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参考文献3

二级参考文献11

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共引文献5

同被引文献12

  • 1周国云,何为,王守绪,何波,王淞,莫芸绮.六层刚挠结合板通孔等离子清洗研究[J].印制电路信息,2009,0(S1):171-176. 被引量：3
  • 2何为,汪洋,何波,龙海荣.刚挠结合印制电路板的制造工艺和应用(英文)[J].世界科技研究与发展,2005,27(3):16-19. 被引量：4
  • 3E.C.W.de Jong,J.A.Ferreira,P.Bauer. 3D Integration with PCB Technology. Applied Power Electronics Conference and Exposition, 2006, APEC'06, Twenty-First Annual IEEE.
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  • 6Lars Martin. Evolution of a Wiring Concept:30 Years of Flex-Rigid Circuit Board Production[J]. Circuitree, 2006, 11 : 22-24.
  • 7黄伟壮.正交实验法在研究板才干花中的应用[J].第二届全国印制电路学术年会论文汇编[D].2002,9.
  • 8骆玉祥,龚永林,袁继旺.印制板电镀与涂覆技术[M].上海:印制电路信息杂志社,2008,2.
  • 9冯亮,聂凤莲.火焰原子吸收法测银最佳仪器条件探讨[J].黄金科学技术,2008,16(1):12-15. 被引量：10
  • 10周国云,何为,王守绪,莫芸绮,毛继美,陈浪,何波.等离子对刚挠结合印制板用材料蚀刻的均匀性及其机理研究[J].印制电路信息,2010(S1):206-214. 被引量：2

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印制电路信息
2006年 第6期

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