摘要
提出一种微透镜阵列复制的新方法反应离子束蚀刻法（ＲＩＢＥ）。它在工作原理和参数控制等方面较传统的蚀刻方法有很大的先进性，能够实现蚀刻过程的精确控制。本文详细阐述了反应离子束蚀刻过程中蚀刻选择性的控制方法，通过对各种蚀刻参数的控制，最终实现了微透镜阵列在硅等红外材料上面形传递的深度蚀刻。口径１００μｍ的Ｆ／２微透镜阵列在硅基底上的传递精度达１１．０３，无侧向钻蚀。
The results on fabrication of refractive microlens arrays using heat forming and reactive ion beam etching (RIBE) techniques are presented. RIBE, with high etching rate and flexible etching ability, is a novel dry etching technique for manufacturing micro optical element. The principle of the method and the controlling of etching selectivity are described. In experimetns, we have fabricated F/2 microlens array with 100 μm diameter in the surface of silicon. An accurate control of etching rate ratio between positive photoresist and silicon was obtained by adjusting multiple etching parameters. The measurement of microlenses showed that the lenslet profile was very close to the standard spherical surface profile. The duplicating ratio is 1∶1.03.
出处
《光学学报》
EI
CAS
CSCD
北大核心
1998年第11期1523-1527,共5页
Acta Optica Sinica
基金
国家科委863高技术项目
关键词
微透镜阵列
微光学
干法蚀刻
反应离子束蚀刻
micro optics, microlens array, dry etching techniques, reactive ion beam etching techniques, fabrication and measurement.
