摘要
对压力传感器芯片的各种封装技术作了比较和讨论，指出它们的优缺点和适用场合。还对各种封接键合材料的特性作了概括。
The various chip mounting techniques for pressure sensors are compared and discussed in this paper, with showing their advantage and disadvantage as well as the applying conditions. The properties for plenty of the bonding and mounting materials are presented.
基金
河北省自然科学基金
