摘要
对采用银浆和250℃、130℃度高、低温锡膏作为芯片键合材料的1W白光LED结温、热阻和光衰进行了对比研究。研究结果表明,与采用银浆作为芯片键合材料的LED相比,采用锡膏作为芯片键合材料的1W白光LED的结温下降了10℃以上,热阻也相应下降了约10K/W;两种键合材料的1W白光LED初始光通量基本没有差别,在光衰试验中,初期均存在光通量提高现象。在环境温度58℃时,工作1400h之后,光通量才开始小于初始光通量;在工作2880h之后,两种键合材料的1W白光LED光衰相差6%。
Ag paste and the 250℃and 130℃solder pastes were used as bonding materials of 1 W white LED, and their junction temperature, thermal resistance as well as light attenuation were compared and discussed. The results show that compared to Ag paste as bonding material, the junction temperature of 1 W white LED with solder paste as bonding material drops by more than 10℃, and its thermal resistance is also declined to more than 10 K/W. However, the initial luminous flux of LED using these two kinds of bonding materials has no difference. In the light attenuation experiment, they all had an increase in luminous flux at beginning. As the environmental temperature is 58 ℃, luminous flux of 1 W white LED with solder paste as bonding material begins less than the initial flux after working for about 1 400 h. In 2 880 h, luminous decay of 1 W white LED with solder paste as bonding material is 6 % lower than that of using Ag paste as bonding material obviously.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第9期857-860,共4页
Semiconductor Technology
基金
江苏省南通市科技计划资助项目(A5034)
关键词
发光二极管
结温
热阻
光衰
键合材料
银浆
锡膏
LED
junction temperature
thermal resistance
light attenuation
bonding material
Ag paste
solder paste
