摘要
对淬火态及重熔再凝固态两种粉末进行 DSC、红外吸收光谱及 X射线衍射谱分析 ,实验表明 ,淬火态的软化点低 ,在 5 0 0～ 5 10℃下完全熔化 ,有利于芯片的低温封接 .重熔再凝固态的熔点高 ( 63 0℃ )、热稳定性好 ,有利于器件的使用 .进一步研究表明 ,淬火态为无序态 ,再凝固态为结晶态 ,其中存在 Pb2 Zn B2 O6 的晶体相 .无论是在无序态中还是在结晶态中 ,[BO3]3- 离子团都不会破裂 ,均出现其分子振动的特征简正模 .
In order to illuminate the relationship between th e behavior characteristics and the bonding technology,DSC,infrared absorption sp ectrum and X-ray diffraction are carried out for two powder of the quenched and recondensed.It can be confirmed through experiments that the softening point (4 50℃) for the quenched is lower and it is melted thoroughly at 500～510℃ for c hip-bonding,but for the recondensed the melting point is higher (630℃).The lat er is of thermal stability without softening point to benefit the usage of devis es.Furthermore,the quenched is a disorder state,the recondensed is a crystalline state,where exists the Pb_2ZnB_2O_6 crystal phase. 3- clusters never break up,showing the characteristic normal modes for molec ular vibration either in quenched or in recondensed states.
关键词
低温玻璃
芯片封接
特性分析
DSC谱
红外吸收谱
X射线衍射谱
low-temperature glass
chip bonding
property analysis
DSC spectrum
infrard absorption spectrum
X-ray diffraction spectrum
