摘要
介绍了ＴＡＢ工艺，包括历史演变，基本的引线键合结构，载带及其制作，缓冲触突与势垒金属层的制作以及内引线和外引线键合。
In this paper,the technology of Tape Automated Bonding(TAB) including structure,the tape and its fabrication,the bump manufacture,the inner bonding as well as the outer bonding are presented.
