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测量计算金属-半导体接触电阻率的方法 被引量:13

Measurement and Calculation of Specific Contact Resistance in Metal-Semiconductor Contacts
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摘要 如何测量、计算得到精确接触电阻值已凸显重要。介绍了多种测量计算金属-半导体欧姆接触电阻率的模型和方法,如矩形传输线模型、圆点传输线模型、多圆环传输线模型等,对各方法的利弊进行了讨论,并结合最新的研究进展进行了评述和归纳。综合多种因素考虑,认为圆点传输线模型是一种较好的测量金属半导体接触电阻率的方法。 How to precisely measure and calculate the contact resistance values becomes an important research project. Various models and methods for the measurement and calculation of special contact resistance in metal-semiconductor contacts were summarized. Both the advantages and disadvantages of the models and methods were discussed, including linear transfer length method, circular transmission line model, multiple annular electrode, etc. Combined with the latest research progress, the operate methods were commented and concluded. Comprehensive balance of various factors, a circular transmission line model (CTLM) was recommended as an ideal method for the measurement of special contact resistance in metal-semiconductor contacts.
作者 李鸿渐 石瑛
出处 《半导体技术》 CAS CSCD 北大核心 2008年第2期155-159,共5页 Semiconductor Technology
基金 国家自然科学基金资助项目(10675094 10205010 10435060)
关键词 金属-半导体接触 接触电阻率 传输线模型 metal-semiconductor contact specific contact resistance transmission line model
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参考文献23

  • 1华文玉,陈存礼.用挖补圆盘法检测金属与薄层、超薄半导体层的欧姆接触性能[J].电子学报,1997,25(8):33-36. 被引量:7
  • 2华文玉,陈存礼.判断金属/薄层半导体欧姆接触质量的一个新方法[J].电子学报,1999,27(8):126-127. 被引量:1
  • 3RECHID J, HEIME K. Concentric ring contacts used for the determination of contacts resistance [J]. Solid-State Electronics, 2000,44(3) :451-455.
  • 4BERGER H H. Models for contacts to planar devices [J]. Solid-State Electronics, 1972,15 (2) : 145-148.
  • 5HU C Y, QIN Z X, FENG Z X, et al. Temperature dependent diffusion and epitaxial behavior of oxided Au/Ni/p-GaN ohmic contact [ J]. Mat Sci and Eng : B, 2006,128 (1-3) : 37-43.
  • 6HU C Y, QIN Z X, CHEN Z Z, et al. Influence of various annealing temperatures on microstructure evolution of oxidized Ni/ Au ohmic contact to p-GaN studied by synchrotron X-ray diffraction [J] .J of Crystal Growth ,2005,285(3) :333-338.
  • 7VOSS L, KHANNA R, PEARTON S J, et al. Use of TiB2 diffusion barriers for Ni/Au ohmic contacts on p-GaN [J]. Applied Surface Science,2006,253(3) : 1255-1259.
  • 8UEN W Y, LI Z Y, LAN S M, et al. Low resistivity ohmic contact to n-type poly-GaN using a Ti/Au/Ni/Au multilayer mental system [ J]. Solid- State Electronics,2007,51:460-465.
  • 9VANGA H, LAZARA M, BROSSSELARDA P, et al. Ni-Al ohmic contact to p-type 4H-SiC [J]. Superlattices and Microstructures, 2006,40 (4-6) : 626-631.
  • 10MARLOW G S, DAS M B.The effects of contact size and nonzero metal resistance on the determination of specific contact resistance [ J]. Solid- State Electronics, 1982,25 : 91-94.

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