摘要
采用化学镀方法在超声辐照下对50nm的SiC进行了化学镀铜,并探讨了孕育期的存在机制以及施镀工艺对化学镀铜的影响。利用XRD、场发射扫描电镜、EDS对粉体镀覆前后成分进行了物相、形貌、成分分析。结果表明:孕育期的存在机理在于镀液中配位剂对活化后粉体表面胶体层的去除;采用双配位剂工艺,配位剂的协同效应能大大提高镀液中Cu2+的利用率,本试验中铜的利用率最低高达89.5%,从而减少了镀后废液的污染;在试验所取温度范围内,随着温度的提高,镀速逐渐升高;通过控制装载量可以实现不同含铜量的复合粉体的制备。
Cu-SiC nano-composite powders were prepared via electroless plating in the presence of ultrasonic radiation.The mechanism of incubation period and the influence of plating conditions on the electroless copper plating of nano-SiC particulates were studied.The phase composition of the resulting composite powders were analyzed by means of X-ray diffraction,the morphology of the Cu plated nano-SiC powders was observed using a scanning electron microscope,and the elemental composition of the Cu-coated nano-SiC powders was determined using an energy dispersive spectrometer.The results indicated that the incubation period was attributed to the removal of the colloid layer on the powders surface by the complexing agent.Compared with traditional single EDTA-2Na complexing agent technology,CuSO4· 5H2O in the electroless solution could be more efficiently used in the presence of double complexing agents,due to its synergistic effect.The usage efficiency of the copper was more than 89.5%,which was beneficial to decreasing the pollution caused by the residue plating solutions.Moreover,the plating rate increased with increasing temperature,while it was feasible to prepare Cu-coated nano-SiC powders with different contents of copper by adjusting the load of raw powder.
出处
《材料保护》
CAS
CSCD
北大核心
2007年第7期45-48,共4页
Materials Protection
基金
某国防重点项目
国家自然科学基金(10502025)
江苏省高校自然基金(05KJB1300421)
关键词
化学镀铜
纳米SIC
双配位剂
孕育期
electroless copper plating
nano-SiC
double complexing agents
incubation period
