摘要
针对金属基体与陶瓷颗粒之间润湿性差的问题,采用化学镀铜对SiC颗粒进行表面改性,试图提高其界面结合能力。采用正交试验方法优化化学镀铜参数,探讨镀液参数对复合粉体质量增加效果的影响。研究表明:化学镀铜过程中,随着硫酸铜浓度和甲醛浓度增加,镀后复合粉体质量增加率增加;随着络合剂浓度增加,质量增加率逐渐降低;化学镀铜参数优化后可实现SiC粉体表面化学镀铜层的均匀镀覆。
In order to improve the wettability between the metal matrix and ceramic particle,the electroless copper plating technology was used to treat the SiC particle for improving the interface bonding capacity. The orthogonal design method was utilized to optimize plating parameters and the effect of solution parameters on the weight gain rate of SiC particle was discussed. The experimental results show that the weight gain rate of SiC particle increases after electroless copper plating when the concentration of CuSO4 and CH3CHO increases,while the weight gain rate gradually reduces with the concentration increase of the chelating agent. The homogeneous plating layers on the SiC particle can be obtained after the parameters optimization of electroless copper plating.
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2013年第3期10-13,共4页
Ordnance Material Science and Engineering
基金
国家自然科学基金项目(51271088)
黑龙江省研究生创新科研项目(YJSCX2012-365HLJ)
佳木斯大学人才培养基金项目(RC2010-029)
佳木斯大学科学研究项目(L2012-009)
关键词
SICP
化学镀铜
表面改性
质量增加率
SiCp
electroless copper plating
surface modification
weight gain rate
