摘要
对采用SMT生产的印制电路组件中出现的几种常见焊接缺陷现象进行了分析,并总结了一些有效的解决措施。
The article analyses several famaliar soldering defects in printed circuit assembly that utilizes surface mount technology (SMT) and summarizes some valid measures to eliminate these defects.
出处
《印制电路信息》
2004年第5期63-65,共3页
Printed Circuit Information
