摘要
主要讨论适应无铅回流焊的工艺及设备,推荐了两种适合于无铅制造的温度曲线(渐升式和梯形),并介绍了无铅回流炉的主要改进:增加温区数量;采用红外辐射与强制对流的加热方式;具有惰性气体环境;助焊剂收集系统;可控制的冷却系统及防止PCB变形的支撑条。最后介绍了可用于监控无铅回流过程的实时热管理系统。
Discuss the reflow technology and equipment to meet the needs of lead-free assembly.Two Profiles(ramp profile and echelon profile) is recommended,and introduce the latest advances in oven design.These oven innovations include:increased reflow zones,infrared radiation and forced-convection,inert atmospheres,Flux collection system, controllable cooling system,board center support rail. Finally,introduce the new trend of monitoring Reflow Solding by The real-time thermal manageer system.
出处
《电子工艺技术》
2004年第2期60-63,67,共5页
Electronics Process Technology
