摘要
采用冲击试验方法研究了各向异性导电胶膜 (ACF)互连的玻璃和柔性基板上倒装芯片 (COG和 COF)的剪切结合强度 .结果表明 :COF比 COG的剪切强度高 .ACF的固化程度达 85 %时有最大的结合强度 .键合温度、导电颗粒状态、缺陷等因素对 ACF互连的结合强度有较大影响 ,而键合压力的影响不大 .
The shear strength of COG and COF bonded with ACF is studied by impact test.The results show that the shear strength of COF is higher than that of COG.There is the maximum dynamic shear strength when the curing degree of ACF is about 85%.The dynamic strength of ACF is influenced strongly by the factors of bonding temperature,particle shapes,and defects,but slightly by the bonding pressure.
基金
国家高技术研究发展计划资助项目 (合同号 :2 0 0 2 AA40 4110
2 0 0 1AA42 12 90)~~
