摘要
液晶显示器件(LCD)的应用范围不断扩大,尤其是在高档电子、通信领域的应用已成为流行的趋势。基于缩小器件体积及降低器件成本的需要,COG(CHIPONGLASS)、COF(CHIPONFILM)模块工艺应运而生。通过对COG-LCD进行未封硅胶时的高温、高湿加速环境应力试验,以及对试验后失效样品的分析,找出造成部分产品使用过程可靠性下降的根本原因,并通过工艺改进提高产品的可靠性。
Liquid Crystal Display(LCD)is applied more and more widely,especially in the field of top grade electronics and communication devices.Based on the requirement of shrink parts and price reduction, COG(CHIP ON GLASS)and COF(CHIP ON FLIM)emerge. The root cause of reliability degradation of some products in usage was identified based on the high temperature and humidity accelerated environmental stress test of COG-LCD and the failure analysis of failed samples, and reliability was improved by the process improvement.
出处
《电子产品可靠性与环境试验》
2004年第5期45-48,共4页
Electronic Product Reliability and Environmental Testing
关键词
液晶显示器件
加速环境应力试验
电极腐蚀
污染
LCD
accelerated environmental stress testing
electrode erosion
pollution
