摘要
以有机锡催化缩合型有机硅树脂为基体树脂的导电银胶为研究对象,通过扫描电镜(SEM)与能谱分析(EDS)分别对失效前后样品的银粉形貌及元素组成进行分析,并推断其失效机理为:银粉与空气中的H2S,SO2和H2O逐渐发生反应,最终可能生成Ag2S,Ag2SO3和Ag2O的混合物。对银胶固化物的体积电阻率进行了研究,表征了失效时间、银粉含量对银胶导电性能的影响,结果表明,银胶的体积电阻率随着失效时间的增加而变大,并随着银粉含量的增加而减小。
The silver conductive adhesives were prepared by silver powder and a kind of organic silicon resin as matrix, the later was a condensation product of silicon resin with dibutyltin dilau- rate as catalyst. Then the failure process of the adhasive was studied in humid atmospheres. The ad- hesives before and after exposure in humid atmospheres were examined by means of SEM and EDS. Results indicated the failure of the adhesive was due to that silver powders within the adhe- sive reacted with H2S, SO： and H20 from the atmospheres, then generated compounds such as Ag2S, Ag：SO3 and Ag20. In the meanwhile, the bulk resistivity of silver conductive adhesives was measured; the effect of exposure time and silver content on the electrical conductivity was also characterized. Results showed that the bulk resistivity of silver conductive adhesives increased with the increasing of exposure time, and decreased with the increasing of silver content.
出处
《腐蚀科学与防护技术》
CAS
CSCD
北大核心
2013年第6期514-517,共4页
Corrosion Science and Protection Technology
基金
上海市科委科技攻关项目(11DZ1140800)资助
关键词
缩合型硅树脂
导电银胶
失效分析
体积电阻率
condensation system of silicon resin, silver conductive adhesive, failure analysis,bulk resistivity
