摘要
本文讨论了聚酰亚胺型导电胶在装片固化时可能产生孔洞的类型及机理,在些基础上确定了随芯片尺寸的增大需对固化工艺进行相应调整的基本原则,并提出了不同尺寸芯片的固化工艺曲线。
The different types of voiding and their forming mechanism during the curing of electrically conductive polyimide adhesive are discussed detailedly in this artile. The genetal principle of adopting the condition for different size of die is thus postulated,and the available curing processes are offered at the same time.
出处
《电子与封装》
2003年第5期21-23,共3页
Electronics & Packaging
