摘要
从能量吸收和应力波传播两方面研究了高冲击下电子线路灌封材料的缓冲机理及材料的选用准则。对硬目标侵彻引信电路体的缓冲提出了相应的措施,实验证明这些措施是合理有效的。
The cushioning mechanism and selecting rules of sealing materials were analyzed from energy-absorption and stress wave spread . The corresponding cushioning measures were adviced for the circuit boards of hard target fuze, which were proved to be effective and reasonable by penetration tests.
出处
《包装工程》
CAS
CSCD
北大核心
2004年第1期44-46,共3页
Packaging Engineering
