摘要
利用水合肼还原制备出粒径分布均匀的铜纳米粉,并对其表面镀银的方法进行了探索。
The size distribution improvement of nanometer copper powders were prepared by chemical reduction method in aqueous solutions, using hydrazine hydrate as a reductive agent, and a method of plating silver on the surface of copper powder has been studied.
出处
《化学与生物工程》
CAS
2003年第6期27-28,共2页
Chemistry & Bioengineering
关键词
铜粉
纳米技术
镀银
导电性能
影响因素
nanometer
copper powder, silver-plating, conducting properties
