摘要
简单论述了铜粉的氧化机理,在此基础上重点介绍了铜粉的几种防氧化技术,即镀金属层、有机磷化物处理、偶联剂处理、还原剂处理等各种技术的作用机理及研究现状。
The oxidation mechanism of copper powder is reviewed simply. The mechanism and research status of several anti-oxidation technologies of copper powder are introduced emphatically. These technologies are metal plating, organic phosphating, couple agent and reducer treatment,etc.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2004年第6期4-6,共3页
Surface Technology
关键词
铜粉
氧化
表面处理
Copper powder
Oxidation
Surface treatment
