摘要
采用置换法还原络合银离子,在铜粉颗粒表面沉积金属银。着重研究了还原剂、络合剂和分散剂种类和用量等制备条件对包覆效果的影响;分析了银包覆程度及银-铜结合强度及复合粉体的抗氧化性。实验表明:银包铜粉体在w(银)为5.00%～18.00%时,与普通铜粉相比,氧化温度可提高40～140℃,具有良好的抗氧化性。
Silver complex ion was reduced to silver coated on particle surface of copper powder. Preparation conditions including species and dosage of complexing agent, reducing agent and dispersant were studied. Coverage extent of silver, bonding intensity of silver-copper and oxidation resistance property were analysed. The results show that oxidation resistance property is improved, and the oxidation temperature of silver-coated copper powder as silver mass fraction is 5.00% - 18.00% can be increased by 40-140 ℃ compared with ordinary copper powder.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第9期66-68,共3页
Electronic Components And Materials
关键词
银包铜粉
银包覆程度
银-铜结合强度
silver-coated copper powder
coverage extent of silver
bonding intensity of silver-copper
